Nitride semiconductor laser device

ABSTRACT

A nitride semiconductor laser device includes an n-type AlGaN clad layer, a GaN layer, a first InGaN light guide layer, a light-emitting layer, a second InGaN light guide layer, a nitride semiconductor inter mediate layer, a p-type AlGaN layer, and a p-type AlGaN clad layer stacked in this order on a nitride semiconductor substrate, wherein the n-type AlGaN clad layer has an Al composition ratio of 3-5% and a thickness of 1.8-2.5 μm; the first and second InGaN light guide layers have an In composition ratio of 3-6%; the first light guide layer has a thickness of 120-160 nm and greater than that of the second light guide layer; and the p-type AlGaN layer is in contact with the p-type clad layer and has an Al composition ratio of 10-35% and greater than that of the p-type clad layer.

PRIORITY STATEMENT

This application is a divisional under 35 U.S.C. §121 of U.S.application Ser. No. 12/591,178, filed Nov. 12, 2009, which claimspriority under 35 U.S.C. §119 to Japanese Application No. 2008-301104,filed on Nov. 26, 2008 with the Japanese Patent Office, the entirecontents of each of which are hereby incorporated herein by reference.

BACKGROUND

1. Technical Field

The present invention is related to a nitride semiconductor laser devicehaving an emission wavelength in a range of 430 nm to 540 nm andparticularly to a nitride semiconductor laser device improved in lasercharacteristics and a method for forming the same.

2. Description of the Related Art

Japanese Patent Laying-Open No. 05-243669 teaches to shift the center ofa waveguide mode toward an n-type clad layer side in a laser deviceincluding an AlGaInP active layer (to reduce the light-confinementeffect on the side where the active layer is in contact with an n-typelayer) by introducing an asymmetrical structure in which an opticalguide layer on the n-type clad layer side is made thicker than the otheroptical guide layer on a p-type clad layer side. With the asymmetricalstructure, it is possible to reduce light absorption in the vicinity ofeach end face of the laser device and increase the output level at whichcatastrophic optical damage occurs, thereby to increase the possibleoutput level of the laser device.

In a nitride semiconductor laser device using InGaN material, on theother hand, there is a problem that the light confinement effect in thelight-emitting layer (active layer) is inherently low in a lasingwavelength range of not shorter than 430 nm. This low light confinementeffect causes decrease of the internal (and external) quantum efficiencyand increase of the threshold lasing current density in the laser deviceand particularly brings about disadvantage for the high output operationof the device. The reason for this low light confinement effect is thatthe refractive index difference between AlGaN material for the cladlayer and GaN material for the light guide layer generally used in thenitride-based semiconductor laser device becomes smaller as thewavelength becomes longer. In general, in order to make the refractiveindex difference sufficient, the Al composition ratio (atomic ratio inthe III group elements) is increased in AlGaN material for the cladlayer and In is added to GaN material for the light guide layer and thenthe In composition ratio is increased as desired. The reason for this isthat the Al acts to decrease the refractive index of GaN and the In actsto increase the refractive index of GaN.

In the case of obtaining sufficient refractive index difference betweenthe clad layer and the light guide layer by adjusting the Al compositionratio and the In composition ratio, however, the crystal latticemismatch is increased between those layers and then there is causedgeneration of cracks and increase of the operation voltage in the laserdevice. The reason of this is that the Al acts to decrease the latticeconstant of GaN and the In acts to increase the lattice constant of GaN.

As a result of the present inventors' study, on the other hand, it wasfound that light leakage toward the p-type layer side due to the weaklight confinement effect in the light-emitting layer causes increase oflight absorption due to Mg of the p-type impurity. Thisdisadvantageously results in decrease of the external quantum efficiencyand increase of the threshold lasing current density.

SUMMARY

In view of the status of the prior art as described above, the object ofthe present invention is related to improvements of the characteristicssuch as decrease of the operation voltage, increase of the externalquantum efficiency and decrease of the threshold lasing current densityin the nitride semiconductor laser device having a emission wavelengthin the range of not shorter than 430 nm.

According to the present invention, a nitride semiconductor laser devicehaving a lasing wavelength in a range of 430 nm to 540 nm includes ann-type AlGaN clad layer, a GaN layer, a first InGaN light guide layer, alight-emitting layer, a second InGaN light guide layer, an intermediatelayer of a nitride semiconductor, a p-type AlGaN layer, and a p-typeAlGaN clad layer stacked in this order on a nitride semiconductorsubstrate, wherein the n-type AlGaN clad layer has an Al compositionratio in a range of 3% to 5% and a thickness in a range of 1.8 μm to 2.5μm; the first and second InGaN light guide layers have an In compositionratio in a range of 3% to 6%; the first InGaN light guide layer has athickness in a range of 120 nm to 160 nm and greater than that of thesecond InGaN light guide layer; and the p-type AlGaN layer is in contactwith the p-type AlGaN clad layer and has an Al composition ratio in arange of 10% to 35% and greater than that of the p-type AlGaN cladlayer.

It is preferable that a total thickness of the second InGaN light guidelayer and the intermediate layer is in a range of 60 nm to 80 nm. Thelight-emitting layer can be formed of one quantum well layer or astacked-layer structure of a quantum well layer/a barrier layer/aquantum well layer. It is preferable that first InGaN light guide layerhas an In composition ratio in a range of 4% to 6%, and the GaN layerhas a thickness in a range of 0.1 μm to 0.3 μm and serves as a cladlayer. The intermediate layer can preferably be fonned of GaN. It ispreferable that the barrier layer is formed of InGaN and has the same Incomposition ratio as that of the first InGaN light guide layer.

A method for forming the nitride semiconductor laser device describedabove preferably includes the steps of crystal-growing by supplying aIII group element source containing In and Ga, a first ammonia gas, anda first carrier gas containing nitrogen and hydrogen; interrupting thecrystal-growing for a prescribed time period by stopping supply of theIII group element source and supplying a second ammonia gas and a secondcarrier gas containing nitrogen and hydrogen; alternately repeating thecrystal-growing step and the interrupting step to form the first orsecond InGaN light guide layer having a prescribed thickness. Theprescribed thickness of the first InGaN light guide layer is preferablyin a range of 120 nm to 160 nm.

In the method, it is preferable that the crystal-growing step producesat one time a crystal layer having a thickness in a range of 25 nm to 40nm. The first carrier gas preferably contains hydrogen in a range of 1%to 20%. The second carrier gas preferably contains hydrogen having thesame concentration as that in the first carrier gas. It is preferablethat a total flow rate of the second ammonia gas and the second carriergas is the same as that of the first ammonia gas and the first carriergas. The second carrier gas preferably contains hydrogen of whichproportion to the second ammonia gas is in a range of 1% to 35%. It ispreferable that a flow rate of the second ammonia gas is greater thanthat of the first ammonia gas. It is also preferable that a flow rate ofthe second ammonia gas is in a range of 1.1 to 3 times that of the firstammonia gas. The second carrier gas preferably contains hydrogen in arange of 1% to 20%. It is preferable that the prescribed time period isin a range of 3 sec. to 180 sec.

With the present invention as described above, it becomes possible toobtain improvements such as decrease of the operation voltage, increaseof the external quantum efficiency and decrease of the threshold lasingvoltage in the nitride semiconductor laser device. It also becomespossible to attain decrease of the power consumption and increase of theoutput power in various display devices by using the improved laserdevice.

Incidentally, the application of the present invention is limited to anitride semiconductor laser device having a lasing wavelength not longerthan 540 nm, because it is difficult to obtain the effects of thepresent invention in a nitride semiconductor laser device having anemission wavelength longer than 540 nm.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of a stacked-layer structurein a wafer including a nitride semiconductor laser structure;

FIG. 2 is a schematic cross-sectional view showing a step ofcrystal-growing according to the present invention;

FIG. 3 is a schematic cross-sectional view showing a step ofinterrupting the crystal-growing according to the present invention; and

FIG. 4 is a schematic cross-sectional view illustrating a wafer having anitride semiconductor laser structure.

DETAILED DESCRIPTION

In the following, an Embodiment according to the present invention isdescribed referring to the drawings. Incidentally, the length, width,thickness, and the like in the drawings are arbitrarily modified toclarify and simplify the drawings and thus do not represent the actualdimensional relationship. Particularly, the thickness is shown witharbitrary enlargement. In the drawings, the same reference numbersrepresent the same or corresponding portions.

Embodiment

A schematic cross-sectional view of FIG. 1 illustrates a stacked-layerstructure in a wafer 10 including a nitride semiconductor laserstructure. This nitride semiconductor laser structure wafer 10 includesan n-type AlGaN clad layer 12, a GaN layer 13, a first InGaN light guidelayer 14, a light-emitting layer 15, a second InGaN light guide layer16, an intermediate layer of a nitride semiconductor 17, a p-type AlGaNlayer 18, and a p-type AlGaN clad layer 19 stacked in this order on anitride semiconductor substrate 11.

It is preferable to use GaN or AlGaN as a material for nitridesemiconductor substrate 11. Use of an AlGaN substrate is particularlypreferable from the viewpoint that it becomes possible to omit n-typeAlGaN clad layer 12 and it is not necessary to take measures to suppresslight leakage into the substrate. In the case of using a GaN substrate,light leakage into the substrate is problematic. The Al compositionratio of the AlGaN substrate is preferably not more than 6%. The mainsurface of nitride semiconductor substrate 11 can be a (0001) plane, anon-polar (1-100) plane or semi-polar (11-22) plane.

N-type AlGaN clad layer 12 can contain Si as a dopant. N-type AlGaN cladlayer 12 may include a non-doped partial layer and/or partial layershaving different Al composition ratios. In other words, n-type AlGaNclad layer 12 may have a superlattice structure ofAl_(x)Ga_(1-x)N/Al_(y)Ga_(1-y)N (x<y), Al_(x)Ga_(1-x)N/GaN, or the like.Further, a partial layer in n-type AlGaN clad layer 12, which is indirect contact with GaN layer 13, can be a non-doped partial layer. Sucha non-doped partial layer can prevent light absorption due to Si dopantin the vicinity of the interface.

The Al composition ratio of n-type AlGaN clad layer 12 is set in a rangeof 3% to 5%. In the case of using n-type AlGaN clad layer 12 having asuperlattice structure of Al_(x)Ga_(1-x)N/Al_(y)Ga_(1-y)N (x<y),Al_(x)Ga_(1-x)N/GaN, or the like, the average Al composition ratio ofthe superlattice is set in a range of 3% to 5%. With such n-type AlGaNclad layer 12, it is possible to decrease the operation voltage andsuppress generation of cracks in the semiconductor laser device.

In the case of n-type AlGaN clad layer 12 having a small Al compositionratio in the range of 3% to 5%, on the other hand, light tends to leaktoward the substrate side, since light-emitting layer 15 has a lasingwavelength not shorter than 430 nm. Therefore, n-type AlGaN clad layer12 preferably has a thickness of at least 1.8 μm. From the viewpoint ofsuppressing generation of cracks due to the lattice mismatch, on theother hand, n-type AlGaN clad layer 12 preferably has a thickness of atmost 2.5 μm. Even in the case of using n-type AlGaN clad layer 12 havinga thickness in such a range, however, it is difficult to make sufficientthe light confinement effect in the light-emitting layer, and thus firstInGaN light guide layer 14 is desirable as described later.

GaN layer 13 has a lattice constant between those of clad layer 12 andfirst light guide layer 14 and can serves as a buffer layer. Further, inthe case that first light guide layer 14 described later has an Incomposition ratio of at least 4%, GaN layer 13 can also serve as a cladlayer. This can improve the light confinement effect. GaN layer 13preferably has a thickness in a range of 0.1 μm to 0.3 μm. With thethickness of least 0.1 μm, the region of the highest light intensityshifts toward the n-type layer side and thus light absorption due tomagnesium (Mg) of a p-type dopant is suppressed so that improvement ofthe external quantum efficiency can be expected. However, it is notpreferable that the thickness exceeds 0.3 μm, because light tends toleak toward the substrate side.

It is preferable that either of first InGaN light guide layer 14 andsecond InGaN light guide layer 16 has an In composition ratio in a rangeof 3% to 6%, and the former has a thickness in a range of 120 nm to 160nm and greater than that of the latter. By using such a high Incomposition ratio and a large thickness, it becomes possible to make theAl composition ratio at most 5% in n-type AlGaN clad layer and improvethe light confinement effect in the light-emitting layer region. As aresult, it becomes possible to realize the low operation voltage and lowthreshold lasing current density in the laser device. It is noted thatan InGaN light guide layer having an In composition ratio more than 6%and a thickness greater than 160 nm is not preferable because it causesincrease of the crystal defects. By making first InGaN light guide layer14 thicker as compared to second light guide layer 16, on the otherhand, the light intensity distribution in the vertical direction(layer-stacking direction) is slightly shifted toward the n-type layerside and becomes an asymmetrical distribution. As a result, lightabsorption due to the p-type impurity is suppressed so that it becomespossible to improve the external quantum efficiency in the laser device.

It is preferable that a total thickness of second InGaN guide layer 16and nitride semiconductor intermediate layer 17 is in a range of 60 nmto 80 nm. The reason for this is that if the total thickness exceeds 80nm, the distance between light-emitting layer 15 and the p-type layerbecomes too large and thus the carrier loss is increased. In the case ofthe total thickness being less than 60 nm, on the other hand, it becomesdifficult to sufficiently shift the light intensity distribution in thevertical direction (layer-stacking direction) toward the n-type layerside and thus light absorption is undesirably increased in the layerscontaining the p-type impurity of Mg.

First InGaN guide layer 14, light-emitting layer 15, second InGaN guidelayer 16, and intermediate layer 17 are preferably non-doped from theviewpoint of enhancing the external quantum efficiency of the laserdevice.

It is preferable that light-emitting layer 15 is formed with one quantumwell layer or includes two quantum well layer (a well layer/a barrierlayer/a well layer). The reason for this is that a well layer more thanthe second does not cause a gain but acts as a light absorption layer.Therefore, it is preferable that light-emitting layer 15 includes one ortwo well layers.

Each well layer preferably has a thickness in a range of 1 nm to 3.4 nmand more preferably in a range of 1.5 nm to 2 nm. The reason for this isthat it is necessary to form an InGaN well layer having a high Incomposition ratio in order to obtain a lasing wavelength not less than430 nm, and if the thickness of such a well layer exceeds 3.4 nm,crystal defects tend to be generated because of the lattice strain. Itis preferable that the barrier layer is also formed of InGaN, and the Incomposition ratio thereof is preferably the same as that of InGaN lightguide layer from the viewpoint of the light confinement effect. Thebarrier layer preferably has a thickness in a range of 10 nm to 20 nm.

Nitride semiconductor intermediate layer 17 is preferably formed of GaN.With this intermediate layer, it becomes possible to relax the latticemismatch between second InGaN light guide layer 16 and p-type AlGaNlayer 18.

P-type AlGaN layer 18 and p-type AlGaN clad layer 19 are formed incontact with each other, and therebetween a layer having a relativelyhigh refractive index as in a usual nitride semiconductor laser deviceis not provided. With this contact structure and first InGaN light guidelayer of a thickness of at least 120 nm, the light intensitydistribution in the vertical direction is not pulled toward the p-typelayer side but effectively shifted toward the n-type layer side. As aresult, it becomes possible to improve the external quantum efficiencyof the laser device.

P-type AlGaN layer 18 preferably has an Al composition ratio in a rangeof 10% to 35% and more preferably in a range of 10% to 20%. P-type AlGaNlayer 18 preferably has a thickness in a range of 8 nm to 20 nm. P-typeAlGaN clad layer 19 preferably has an Al composition ratio in a range of3% to 5% and smaller than that of n-type AlGaN clad layer 12. With theseconditions, it becomes possible to decrease the operation voltage of thelaser device.

Incidentally, it is possible to use Mg as the p-type impurity. Further,it goes without saying that a p-type GaN contact layer (not shown inFIG. 1) may be deposited on p-type AlGaN clad layer 19.

(Formation of InGaN Light Guide Layer)

First InGaN light guide layer should have an In composition ratio in arange of 3% to 6% and have a thickness of at least 120 nm. If such anInGaN layer is crystal-grown by a usual method, crystal defects aregenerated and phase separation into regions of high and low Incomposition ratios is caused in the InGaN layer. The InGaN layer havingsuch a low crystalline quality is not suitable for the laser device. Inthe present invention, therefore, first InGaN light guide layer 14 isformed by a method as described below. It goes without saying thatsecond InGaN light guide layer 16 may be formed by a method similar tothat for first InGaN light guide layer 14.

A method for forming the first (or second) InGaN light guide layeraccording to the present Embodiment includes a crystal-growing step offorming a partial layer of the InGaN light guide layer, agrowth-interrupting step, and repetition of these steps until thethickness of the InGaN light guide layer reaches a desired thickness.Schematic cross-sectional views of FIGS. 2 and 3 illustrate a method forforming the first (or second) InGaN light guide layer.

(Crystal-Growing Step)

In the crystal-growing step as shown in FIG. 2, a partial layer 14 a ofInGaN light guide layer 14 is deposited by supplying a III group elementsource 101 containing In and Ga, a first ammonia gas 102, and a firstcarrier gas 103 containing nitrogen and hydrogen.

Here, partial layer 14 a corresponds to one of partitive divisions inthe complete thickness of InGaN light guide layer 14. In other words,InGaN light guide layer 14 (see FIG. 1) is not formed by onecrystal-growing step but formed up to the complete thickness by stackingplurality of partial layers 14 a with a plurality crystal-growing steps.

Partial layer 14 a of InGaN light guide layer 14 preferably has athickness in a range of 25 nm to 40 nm. It is possible to obtain aneffect of suppressing generation of crystal defects by stacking partiallayers 14 a to form InGaN light guide layer 14. The thickness of partiallayer 14 a greater than 40 nm is not preferable because it reduces theeffect of suppressing generation of crystal defects. On the other hand,the thickness of partial layer 14 a smaller than 25 nm is not preferablefrom the viewpoint of productivity because it increases necessary numberof the crystal-growing steps for foi ming partial layers 14 a tocomplete InGaN light guide layer 14.

When partial layer 14 a of InGaN light guide layer 14 is formed on GaNlayer 13, the substrate temperature is set to the same temperature as inthe case of depositing light-emitting layer 15, and then a III groupelement source 101 containing In and Ga, a first ammonia gas 102, and afirst carrier gas 103 containing nitrogen and hydrogen are introducedinto MOCVD (metal organic chemical vapor deposition) apparatus (see FIG.2). Here, the temperature suitable for crystal-growing partial layer 14a of InGaN light guide layer 14 is in a range of 600° C. to 850° C.

In order to obtain a high In composition ratio, it is necessary toincrease the supply amount of the III group element source at arelatively lower crystal growth temperature. In the case of formingfirst InGaN light guide layer 14 with such condition, excess In atomsthat can not have been taken in the layer tend to precipitate on thesurface of the layer (segregation of In atoms) and then crystal defectsgenerated in the layer is increased. This tendency becomes moresignificant as the thickness of InGaN light guide layer 14 is increased.In the present invention, therefore, InGaN light guide layer 14 isdivided into some partial layers each having a thickness in a range of25 nm to 40 nm.

In the crystal-growing step shown in FIG. 2, the first carrier gasnecessarily contains hydrogen. The reason for this is that hydrogenshould be supplied during growth of the InGaN light guide layer in orderto remove excess In atoms on the crystal-growing surface. Usually, onlynitrogen is used as a carrier gas during formation of an InGaN layer.The reason for this is that it is not easy to form an InGaN layer havinga high In composition ratio by using carrier gas containing hydrogen.Further, if a nitrogen carrier gas unintentionally contains hydrogen,the In composition ratio fluctuates and a desired InGaN layer can notobtained.

As a result of the present inventors' experiment, however, it was foundthat in the case of the In composition ratio in III group elements beingnot more than about 8%, a desired InGaN layer can be obtained even byusing a carrier gas containing hydrogen. It was also found that an InGaNlayer formed using a carrier gas containing hydrogen shows higherphotoluminescence (i.e., better crystalline quality) as compared to oneformed using a carrier gas not containing hydrogen. It was further foundthat fluctuation of the In composition ratio is very small, which isrelated to variation of the hydrogen content during repetition of thecrystal-growing step of FIG. 2 and the growth-interrupting stepdescribed later.

First carrier gas preferably has a hydrogen concentration in a range of1% to 20%. By supplying hydrogen in this concentration range, it ispossible to remove excess In atoms on the crystal-growing surface andthen form the InGaN light guide layer having a good crystalline quality.Here, the hydrogen concentration in first carrier gas 103 means{hydrogen flow rate in first carrier gas 103/(hydrogen flowrate+nitrogen flow rate in first carrier gas 103)}×100.

In the case that the hydrogen concentration of first carrier gas 103 isthe same as that of second carrier gas 113 described later, fluctuationof the In composition ratio is further suppressed in the InGaN lightguide layer and then the electron energy band gap level of the InGaNlight guide layer can be stabilized.

If the gas flow rate largely changes between the crystal-growing step ofFIG. 2 and the growth-interrupting step in a MOCVD method for crystalgrowth, stabilization of the reaction gas atmosphere tends to beretarded due to a problem of followability of the gas flow speed to theflow rate change. If such retardation occurs in stabilization of thereaction gas atmosphere, crystal growth does not become stable in therepeated crystal-growing steps and then it becomes difficult to form thedesired InGaN light guide layer. From this point of view, it ispreferable that the total flow rate of first ammonia gas 102 and firstcarrier gas 103 is the same as that of second ammonia gas 112 and secondcarrier gas 113 described later. Under such condition, change of the gasflow rate becomes small at the process change from the crystal-growingstep to the growth-interrupting step and vice versa and then it becomespossible to form the InGaN light guide layer having the desiredcrystalline quality.

(Growth-Interrupting Step)

A schematic cross-sectional view of FIG. 3 shows a growth-interruptingstep after the crystal-growing step of forming partial layer 14 a ofInGaN light guide layer 14. In this growth-interrupting step, supply ofIII group element source used in the crystal-growing step of FIG. 2 isstopped, and then a second ammonia gas 112 and a second carrier gas 113composed of nitrogen and hydrogen is supplied to interrupt the crystalgrowth for a prescribed time period. With this growth-interrupting step,it is possible to remove excess In atoms on a surface of the InGaN lightguide layer having a high In composition ratio and suppress generationof crystal defects in the InGaN layer. Then, by repeating thecrystal-growing step of FIG. 2 and the growth-interrupting step of FIG.3, it is possible to form the thick (at least 120 nm) InGaN light guidelayer having a good crystalline quality.

Excess In atoms remained on the surface of the partial layer 14 a ofInGaN light guide layer 14 are removed mainly by etching effect ofhydrogen contained in second carrier gas 113. Since hydrogen has strongetching effect, there is a possibility that it also etches a surface ora part of partial layer 14 a formed in the crystal-growing step of FIG.2 thereby causing surface roughness and makes it difficult to attain thedesired layer thickness. To prevent this possibility, second ammonia gas112 is also supplied in the growth-interrupting step. This secondammonia gas 112 also causes the effect of removing excess In atoms onthe layer surface, though the etching effect thereof is not as much asthat of hydrogen contained in second carrier gas 113. This means thatthe flow rate of hydrogen having strong etching effect can be decreasedby increasing the flow rate of second ammonia gas 112. The proportion ofhydrogen contained in second carrier gas 113 to second ammonia gas ispreferably in a range of 1% to 35%. Here, the proportion of hydrogencontained in second carrier gas 113 to second ammonia gas 112 means(hydrogen flow rate in second carrier gas/second ammonia gas)×100.

The flow rate of second ammonia gas 112 is preferably not less than andmore preferably in a range of 1.1 to 3 times that of first ammonia gas102 used for formation of partial layer 14 a of InGaN light guide layer14. The reason for this is that by increasing the flow rate of secondammonia gas 112 as compared to that of first ammonia gas 102 it becomespossible to enhance the effect of removing excess In atoms on the layersurface and decrease the flow rate of hydrogen having strong etchingeffect.

The flow rate of hydrogen in second carrier gas 113 is preferably in arange of 1% to 20%. With hydrogen in this range, it is possible toremove excess In atoms on the layer surface. The hydrogen concentrationexceeding 20% is not preferable because the etching effect on partiallayer 14 a of InGaN light guide layer becomes too much. Here, thehydrogen concentration in second carrier gas 113 means {hydrogen flowrate in second carrier gas/(hydrogen flow rate+nitrogen flow rate insecond carrier gas)}×100.

The time period for the growth-interruption is preferably in a range of3 sec. to 180 sec. The interruption time shorter than 3 sec. is notpreferable because it becomes difficult to obtain sufficient effect ofremoving excess In atoms. The interruption time longer than 180 sec. isalso not preferable because partial layer 14 a of InGaN light guidelayer 14 is damaged by etching.

The substrate temperature during the growth-interruption is preferablythe same as that during formation of partial layer 14 a of InGaN lightguide layer 14. The reason for this is that it is very difficult tochange and stabilize the substrate temperature within the optimalinterruption time (in the range of 3 sec. to 180 sec.). Since variationof the substrate temperature directly influences the effect of removingexcess In atoms on the crystal-growing surface, it becomes difficultunder the unstable substrate temperature to obtain the uniformity andreproducibility of the In composition ratio in InGaN light guide layer14.

While the crystal growth has been explained using an MOCVD apparatus inthe above Embodiment, it goes without saying that the crystal growth mayalso be carried out by using an MOMBE (metal organic molecular beamepitaxy) apparatus, HYPE (hydride vapor phase epitaxy) apparatus, or thelike.

EXAMPLE

A schematic cross-sectional view of FIG. 4 shows a wafer having anitride semiconductor laser structure produced in one Example of thepresent invention. A method for fanning this nitride semiconductor laserstructure wafer corresponds to the method for forming this nitridesemiconductor laser structure wafer described in the above Embodiment.

This nitride semiconductor laser structure wafer 220 includes an n-typeGaN layer 201, an n-type AlGaN clad layer 202, a non-doped GaN layer203, a first non-doped InGaN light guide layer 204, a light-emittinglayer 205, a second non-doped InGaN light guide layer 206, a non-dopedGaN intermediate layer 207, a p-type AlGaN layer 208, a p-type AlGaNclad layer 209, and p-type GaN contact layer 210 stacked in this orderon a (0001) plane of a n-type GaN substrate 200.

In formation of nitride semiconductor laser structure wafer 220, n-typeGaN substrate 200 is first heated to 1050° C. and maintained at thistemperature in an MOCVD apparatus, and then n-type GaN layer 201 of 0.5μm thickness is formed on n-type GaN substrate 200 by introducing TMG(trimethylgallium) for a source of a III-group element, ammonia gas, anda doping gas of SiH₄ containing Si. This n-type GaN layer 201 is formedto improve the surface morphology and relax the residual surface stressand strain on polished n-type GaN substrate 200 thereby to provide asurface suitable for epitaxial crystal growth.

Subsequently, TMA (trimethylaluminum) for a source of a III-groupelement is also introduced in the MOCVD apparatus to form n-type AlGaNclad layer 202 of 2.5 μm thickness having an Si impurity concentrationof 5×10¹⁷/cm³. In this n-type AlGaN clad layer 202, the Al compositionratio in III group elements is 5%.

Next, non-doped GaN layer 203 of 0.2 μm thickness is formed by stoppingsupply of TMA and SiH₄ into the MOCVD apparatus.

Thereafter, the substrate temperature is lowered to 800° C., and thenTMG and trimethylindium (TMI) is supplied to form first non-dopedIn_(0.035)Ga_(0.965)N light guide layer 204 of 150 nm thickness.

Light-emitting layer 205 including two quantum well layers is formed onfirst In_(0.035)Ga_(0.965)N light guide layer 204. More specifically, information of this light-emitting layer 205, a non-dopedIn_(0.13)Ga_(0.87)N well layer of 3 nm thickness, a non-dopedIn_(0.035)Ga_(0.965)N barrier layer of 16 nm thickness, and a non-dopedIn_(0.13)Ga_(0.87)N well layer of 3 nm thickness are stacked in thisorder.

Second non-doped In_(0.035)Ga_(0.965)N light guide layer 206 of 70 nmthickness and non-doped GaN intermediate layer 207 of 10 nm thicknessare stacked in this order on light-emitting layer 205.

Thereafter, the substrate temperature is raised to 1120° C. tosequentially form Mg-doped Al_(0.2)Ga_(0.8)N layer 208 of 20 nmthickness, Mg-doped Al_(0.04)Ga_(0.94)N clad layer 209 of 0.6 μmthickness, and Mg-doped p-type GaN contact layer 210 of 0.1 μmthickness, thereby finishing crystal growth of nitride semiconductorlaser structure wafer 220. Here, it is possible to use (EtCp)₂Mg for asource gas containing Mg.

In the following, further explanation is given for formation of firstInGaN light guide layer 204 that is an important feature of the presentinvention. It is noted that second InGaN light guide layer 206 can alsobe formed by a method similar to that described below.

In crystal growth of first InGaN light guide layer according to thepresent Example, a non-doped In_(0.035)Ga_(0.965)N layer of 30 nmthickness is formed as a partial layer of first InGaN light guide layerby using TMI and TMG for a III group element source containing In and Ga(corresponding to 101 in FIG. 2) and supplying a first ammonia gas of 6L/min. (corresponding 102 in FIG. 102) together with a first carrier gascontaining nitrogen of 8 L/min. and hydrogen of 0.5 L/min.(corresponding to 103 in FIG. 2) at a substrate temperature of 800° C.

Subsequently, in the growth-interrupting step according to the presentExample, the crystal growth is stopped for 40 sec. at the same substratetemperature of 800° C. by stopping supply of the III group elementsource containing TMI and TMG and supplying a second ammonia gas of 6L/min. (corresponding to 112 in FIG. 3) together with a carrier gascontaining nitrogen of 8 L/min. and hydrogen of 0.5 L/min.(corresponding to 113 in FIG. 3). Then, the first InGaN light guidelayer is formed to a 150 nm thickness by repeating 5 times the abovedescribed crystal-growing step and growth-interrupting step.

The nitride semiconductor laser device obtained according to the presentExample showed excellent laser characteristics, i.e., lasing wavelengthof 440 nm, operation voltage of 5.3 V, external quantum efficiency of1.5, and threshold current density of 2.5 kA/cm².

As described above, according to the present invention, it becomespossible to obtain improvements of laser characteristics such asdecrease of the operation voltage, increase of the external quantumefficiency and decrease of the threshold lasing current density in thenitride semiconductor laser device having a emission wavelength in therange of 430 nm to 540 nm. Further, such improved laser device canpreferably be used in combination with phosphors in a white light sourcehaving a high luminance, used as a blue of green light source, used inlight display device including an RGB (red, green, blue) light source,and used in a laser projector including an RGB light source.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the scopeof the present invention being interpreted by the terms of the appendedclaims.

What is claimed is:
 1. A method for forming an InGaN layer, the methodcomprising: growing a crystal layer by supplying a group III elementsource, a first ammonia gas, and a first carrier gas, the group IIIelement source containing In and Ga, the first carrier gas containingnitrogen and hydrogen, interrupting said growing step for a time periodby stopping the supplying of said group III element source and supplyinga second ammonia gas and a second carrier gas containing nitrogen andhydrogen, alternately repeating said growing step and said interruptingstep to form said InGaN layer having a first thickness.
 2. The methodaccording to claim 1, wherein said first thickness of said InGaN layeris in a range of 120 nm to 160 nm.
 3. The method according to claim 1,wherein said growing step produces the crystal layer having a thicknessin a range of 25 nm to 40 nm during the supplying of said group IIIelement source, said first ammonia gas, and said first carrier gas. 4.The method according to claim 1, wherein said first carrier gas containshydrogen in a range of 1% to 20%.
 5. The method according to claim 4,wherein said second carrier gas contains a same concentration ofhydrogen as said first carrier gas.
 6. The method according to claim 1,wherein a total flow rate of said second ammonia gas and said secondcarrier gas is equal to a total flow rate of said first ammonia gas andsaid first carrier gas.
 7. The method according to claim 1, wherein aproportion of the hydrogen in said second carrier gas to said secondammonia gas is in a range of 1% to 35%.
 8. The method according to claim1, wherein a flow rate of said second ammonia gas is greater than thatof said first ammonia gas.
 9. The method according to claim 8, whereinthe flow rate of said second ammonia gas is in a range of 1.1 to 3 timesthat of said first ammonia gas.
 10. The method according to claim 1,wherein said second carrier gas contains hydrogen in a range of 1% to20%.
 11. The method according to claim 1, wherein said time period is ina range of 3 seconds to 180 seconds.